There are many types of reflow soldering oven according to different working technology, but we just list three main types among it in the following, please have a look: Many usually exclude the cooling zone when calculating the temperature zone, that is, only the heating zone, heat preservation zone, and welding zone. Usually, the length for each soldering zone is about 45-50cm, the quantity for the soldering zone is from three to fifteen or even more.įurthermore, for the function of the soldering zone, reflow welding has at least three temperature zones, namely the preheating zone, welding zone and cooling zone. PCB enters into the cooling area to solidify the solder joint reflow welding is completed.The liquid solder can wet, diffuse, diffuse or reflow the solder pad, component end and pin of PCB to form a solder joint. When the PCB enters the welding area, the temperature rises hastily to make the solder paste melt.When PCB enters the insulation area, the PCB and components are fully preheated to prevent PCB and components from being damaged due to PCB suddenly entering the welding high-temperature area.The solder paste softens, collapses, and covers the pad, isolating the pad and component pin from oxygen. At the same time, the flux in the solder paste moistens the pad, component end, and pin. When the PCB enters the heating zone, the solvent and fuel are inside the solder paste evaporate.Therefore, it is called “reflow soldering”, because the gas circulates in the welder to generate high temperature to achieve the welding purpose. Reflow soldering relies on the effect of hot airflow on the solder joint, and the soldering flux reacts physically under the fixed constant excessive temperature air go with the drift to reap to achieve SMD welding Technically, Reflow is to realize the mechanical and electrical connection between the solder end or pin of the surface assembly component and the PCB pad by remelting the paste solder allocated to the PCB pad in advance. With the development of SMT technology and the emergence of SMC and SMD, Reflow soldering technology and equipment as parts of SMT technology have been developed accordingly, and its application has become more and more extensive, almost in all electronics product fields. It working principle is as the following:Īlways, it locates after the pick and place machine, and solders the PCB board and component with heating and melting, at last cool the solder to link the PCB board and component together. 1.2 Working PrincipleĪs one of the three main machines in the SMT line. Most of the components are chip capacitor, chip inductor, mount transistor, and two-transistor. Generally, it is used in the assembly of a hybrid integrated circuit board. W hat is A R eflow S oldering oven? 1.1 Background & DefinitionĪ Reflow oven is a machine used primarily for Reflow soldering of surface mount electronic components to printed circuit boards (PCB). Large area filters offer long life and on-the-fly replacement.1. Cureflow™ Ovens are available with either a mesh belt or Edge Grabber™ conveyor. Access to the process cavity is available from either side of the assembly line via the patented hood lift while also allowing the same system to serve in either a Right to Left or Left to Right process direction. Cross-platform (Windows, Machintosh, Linux) Software provides an easy to learn and easy to use interface to control the solder reflow oven. The 1.75 inch throat opening (above and below the Edge Grabber ™ conveyor pass-line) accepts tall electronic assemblies. Air is cascaded from one zone to the next reducing energy consumption. Columnized air retains its direction and velocity resulting in maximum impingement velocity on the product, high energy transfer and Near Equilibrium Heating™. The air is heated and forced through nozzles onto the product. Recycled and Cascaded air is drawn from the low thermal mass process cavity with tangential blower wheels running the full width of the process cavity for even airflow. Low mass coil heating elements provide quick response for varying production loads ensuring process repeatability. Infra-red “boosters” provide quick temperature acceleration to high thermal mass components or ground planes while Recirculating Hot Air (RHA) blowers maintain even temperature to all areas of the assembly. Utilizing existing technologies from other ETS Factory Automation, Material Handling Conveyors and Thermal Ovens, Cureflow™ optimizes thermal energy transfer to electronic assemblies through its unique combination of Convection and Infra-red heat delivery systems. SMT Reflow Ovens for Solder Reflow and Adhesive Curing: Cureflow™ is a flexible family of products designed for Lead or Lead Free Solder Reflow, adhesive curing and other Surface Mount Technology (SMT) heating and thermal processing requirements. Solder Reflow and Adhesive Curing Oven Cureflow ™
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